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Photos
Introduction
The
high-density, ceramic-based thermal compound
specifically designed for modern high-power
CPUs and high-performance heatsinks or water-cooling
solutions. The Evolution of Cool!
Features
High-Density
ceramic content:
Céramique uses a high-density layered
composite of five unique shapes of thermally
conductive aluminum oxide, boron nitride and
zinc oxide sub-micron particles to maximize
particle-to-particle contact area and thermal
transfer. This exclusive combination provides
performance exceeding most metal based compounds.
Controlled
Triple-Phase Viscosity:
Céramique does not contain any silicone.
The
suspension fluid is a proprietary mixture
of advanced polysynthetic oils that provide
superior performance and long-term stability.
During
the system's initial use, the heat from the
CPU lowers the viscosity of the compound to
enhance the filling of the microscopic valleys
and ensure a minimum bond line between the
heatsink and the CPU core. Then the compound
thickens slightly over the next 100 to 300
hours of use to its final consistency designed
for long-term stability.
(This should not be confused with conventional
phase change pads that are pre-attached to
many heatsinks. Those pads melt each time
they get hot then re-solidify when they cool.
The viscosity changes that Céramique
goes through are much more subtle and ultimately
much more effective.)
Excellent
Stability:
Céramique is engineered to not separate,
run, migrate, or bleed.
Electrical
Insulator:
Céramique does not contain any metal
or other electrically conductive materials.
It is a pure electrical insulator, neither
electrically conductive nor capacitive.
Performance:
2 to 10 degrees centigrade lower CPU full
load core temperatures than standard thermal
compounds or thermal pads when measured with
a calibrated thermal diode imbedded in the
CPU core.
Easy
Clean Up:
Céramique can easily be cleaned from
CPUs and heatsinks with isopropyl alcohol
or any of the cleaners listed in the product
instructions.
Innovative
Dispenser:
The 2.5-gram Céramique is the first
product available in our proprietary thermal
compound syringe. Our new syringe is more
compact, easier to handle and dispenses a
higher percentage of its content than standard
industrial or medical syringes. The amount
of compound remaining in the syringe is easy
to determine as the rear of the plunger is
perfectly flush with the flange when the syringe
is empty.
Compliancy:
RoHS Compliant.
Specifications
Thermal
Resistance:
<0.007°C-in2/Watt (0.001 inch layer)
Thermal
Conductance:
>200,000W/m2.°C (0.001 inch layer)
Average
Particle Size:
<0.38 microns <0.000015 inch
( 67 particles lined up in a row equal 1/1000th
of an inch. )
Temperature
limits:
Peak: –150°C to >180°C Long-Term:
–150°C to 125°C
Coverage
Area:
2.5-gram syringes. (About 1cc)
At a layer 0.003" thick, one tube will
cover approximately 20 square inches.
22-gram
syringes. (About 8cc)
At a layer 0.003" thick, one tube will
cover approximately 160 square inches.
Important
Reminder:
Due
to the unique shapes and sizes of the particles
in Céramique, it will take a minimum
of 25 hours and several thermal cycles to
achieve maximum particle to particle thermal
conduction and for the heatsink to CPU interface
to reach maximum conductivity. (This period
will be longer in a system without a fan on
the heatsink.) On systems measuring actual
internal core temperatures via the CPU's internal
diode, the measured temperature will often
drop slightly over this "break-in"
period. This break-in will occur during the
normal use of the computer as long as the
computer is turned off from time to time and
the interface is allowed to cool to room temperature.
Once the break-in is complete, the computer
can be left on if desired.
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